• Stay BUY and MYR2.93 TP, 26% upside and c.4% yield. Despite posting a record-high revenue in 2Q25, Unisem’s core earnings came in below expectations, impacted by elevated pre-operating costs and loss-making Malaysian operations. Management remains confident of sustained demand into 3Q25, with flattish-to-higher QoQ loadings driven primarily by its Chengdu plant. We continue to like the stock for its semiconductor exposure, and anticipate earnings to rebound once the Malaysian plant utilisation improves and cost structures normalise – unlocking operating leverage.
  • Earnings miss despite topline beat. 1H25 revenue rose 18.4% YoY to MYR898.8m, exceeding expectations. However, core net profit of MYR7.3m (-72.7% YoY) was weak, achieving just 6.6% and 9.6% of our and consensus full-year forecasts. EBITDA was flattish YoY, with margins down to 15.8% from 18.7% due to pre-operating expenses for Gopeng plant and more than MYR20m losses at the Malaysian operations (including Unisem-Advanpack Technologies (UAT), compounded by a higher-than-expected effective tax rate. Chengdu now contributes c.65% of group revenue. A second interim dividend of MYR0.02/share (flat YoY) was declared.
  • 2Q25 revenue hits record high, but costs drag profitability. USD-denominated revenue grew for a fifth consecutive quarter, up 15.1% QoQ to a record USD110.6m – driven by broad-based strength in Chengdu operations (except communications). However, core earnings contracted 30.5% QoQ and 79% YoY to MYR3m due to the loss-making Malaysian segment, elevated Gopeng start-up costs, rising headcount, and increased depreciation charges. Total headcount rose to 7,181 (from 6,814 in 1Q25) to support volume ramp-up. 2Q25 capex reached another record at MYR185.6m, primarily for Chengdu Phase 3 expansion.
  • Outlook. Guidance points to a flattish to higher QoQ revenue, supported by resilient demand in MEMS microphones, PMICs for servers, and EV-related applications. Notably, automotive customer loadings have increased over the past two quarters and are expected to remain firm in 2H25. A major customer is also accelerating its relocation to new facilities amid geopolitical shifts. While Chengdu will likely maintain high utilisation, Malaysian operations remain sub-optimal, weighed down by customer caution over tariff uncertainties. The Gopeng plant qualifications are ongoing, with all leadless packages to be relocated there. The Simpang Pulai facility will focus on leaded packages, wafer-level-chip-scale-packaging (WLCSP), and dedicated lines.
  • We cut FY25-27F earnings by 51%, 22% and 9% as we bake in lower margin and higher depreciation and cost assumptions. Our TP is kept at MYR2.93 after rolling forward our valuation base year to FY26F, pegged to an unchanged 30x FY26F P/E (+1.5SD from its 5-year mean), inclusive of a 2% ESG premium. Downside risks: Slower-than-expected orders, technology obsolescence, and unfavourable FX movement.